Samsung begins mass production of ePoP for smartphones

Author: Samsung   Time: 2015-02-04


Samsung Electronics announced that it is now mass producing embedded package on package (ePoP) memory. This is a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card) and a controller. For use in high-end smartphones, the extremely thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space. That is a distinct improvement over existing two-package eMCP memory solutions, Samsung said.

The company plans to expand its line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market. Samsung already has been offering a similar single-package solution for wearable devices, referred to as “wearable memory”. The new configuration for phones can be customized not only for use in flagship smartphones but also in other devices such as high-end tablets.